Technology Curriculum
Developing leading-edge curriculum to teach the engineers of tomorrow is a challenge faced by universities around the world. The Intel® Higher Education Program works to accelerate this process by providing "world class" curriculum modules developed by leading universities worldwide. All course content has been developed by university faculty and is provided free of charge.*
Curricula
The curriculum modules contained in the Intel® Higher Education Curriculum Forum are not Intel product training, nor an Intel certification program. The content can be used in its entirety to start new courses or piecemeal to supplement existing courses. University faculty are the primary audience; however students or other visitors are welcome to use the content for their own educational purposes.
Intel Multi-core Curriculum Initiative ›
The maximum potential of multi-core systems to deliver great performance and expanded usages is unleashed only when software is designed to take advantage of the machine's full capabilities. With the entire industry moving towards the multi-core architecture, it has become imperative for the universities to introduce parallel programming in main stream education. To enable universities to successfully introduce real world multi-threading concepts, Intel Corporation has developed a program to provide tools, industry expertise and training modules for universities to use in their classrooms.
Parallel Computer Architecture and Programming Example Curriculum ›
This course provides a deep understanding of the principles and engineering tradeoffs involved in designing modern parallel computers (aka "multiprocessors" and "multicore"), as well as the programming techniques to effectively utilize these machines.
Microelectronic Fabrication Curriculum ›
Today's fabrication technologies draw upon a wide variety of disciplines, and a diverse scientific and mathematical base. The Microelectronic Fabrication Curriculum is designed specifically to address these aspects of "process science" in an interdisciplinary way.
MicroElectronics Packaging Curriculum ›
"MicroElectronics assembly and packaging technology" or "Packaging" is a key element to Intel manufacturing and product development. This suite of courses reflects a two year masters program designed to provide the necessary multi-disciplinary background.
VLSI Curriculum ›
The VLSI Curriculum presents the complete coursework that may be considered when creating a VLSI program. The coursework is sequenced to show the interconnects between key areas such as analog design, digital design and overall architecture planning.
Wireless Computing Curriculum ›
Wireless computing is becoming the standard for implementing computing and communication applications. This section presents two options on how wireless curriculum can be put into practice in existing computer science and electrical engineering programs.
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