Instructor : Nik Chawla, Associate Professor
Text : Materials Science and Engineering: An Introduction, 2005, 6 th Edition, by W.D. Callister, Jr. (required)
| Grading : | Homework 25% |
| Exam 1 25% | |
| Exam 2 25% | |
| Exam 3 25% |
|
Lectures
E-Lectures from Text |
Topic | Reading |
| 1 | Introduction, atomic structure, atomic bonding in solids | Chs. 1 and 2 |
| 2 | Crystal structures | Ch. 3 |
| 3 | Defects and Dislocations | Ch. 4 |
| 4 | Diffusion | Ch. 5 |
| 5 | Mechanical properties | Ch. 6 |
| 6 | Dislocations and strengthening of metals | Ch. 7 |
| 7 | Fracture | Ch. 8 |
| Mid Term Exam 1 | ||
| 8 | Phase diagrams | Ch. 9 |
| 9 | Phase Transformations | Ch. 10 |
| 10 | Processing of Metals and Metallic Alloys | Ch. 11 |
| 11 | Structure and Properties of Ceramics | Ch. 12 |
| 12 | Processing of Ceramics | Ch. 13 |
| 13 | Polymers: Processing and Structure | Chs. 14 and 15 |
| 14 | Composite Materials | Ch. 16 |
| 15 | Corrosion | Ch. 17 |
| Mid Term Exam 2 | ||
| 16 | Electrical properties | Ch. 18 |
| 17 | Thermal properties | Ch. 19 |
| 18 | Magnetic properties | Ch. 20 |
| 19 | Optical properties | Ch. 21 |
| 20 | Materials selection | Ch. 22 |
| Mid Term Exam 3 | ||
| 21 | Materials selection | |
| 22 | Applications of Pb-free Solders in Packaging | |
| 23-26 | Challenges and Applications of Materials in Packaging | Industry Guest Lecturers |
Homework will be assigned weekly on every Tuesday. Each assignment will be due one week after it was assigned. No late homework will be accepted.